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Key
Features:
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Multi-mode
A-scans, full-waveform B-scans and C-scans acquired and displayed in
real-time
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Multiple applications
Area flaw detection (aerospace, weld inspection, etc)
Area mapping (e.g. corrosion inspection)
Buried-layer crack detection using angled-beam heads
- Flexible
Use with arrays for real-time A, B and C-scans
Use arrays with
ANDSCAN® for rapid seamless large area mapping
- Real-time B-scans
Rates suitable for interactive fast search (typically over 100Hz)
Ideal for inspecting complex cross-sections
- C-scans
Simultaneous Amplitude and Time-of-Flight displays in real-time
Re-calculate using different gates from full-waveform data
- Rapid area coverage (19.4 sq. ft/min)
Full-waveform capture at up to 1.8m_/min for 1mm_ pixels (19.4sq.ft/min)
- High performance
State of the art Digital Flaw Detector with imaging capability
- User friendly
Windows XP™ operation for familiar “look-and-feel” and for
easy transfer of data and setups into reports and archiving
- Small, light and robust
Ruggedized PC
- Flexible power source
100-250VAC (24V DC Power Supply Optional)
- Post Processing Option
Comprehensive full-waveform analysis package
- Seamless Large Area
Rapid full waveform acquisition over large areas without
Mapping stitching using the
ANDSCAN® System
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Specifications:
PC
Processor: Intel Pentium 4, 2.8GHz
(PC Specifications are subject to market availabilities)
Display: 14-inch LCD (1024x768) (Optional 15.4" TFT LCD)
Memory: 512MB DDR RAM
(Upgradeable to 1 GB)
Hard Disk Drive: 80GB EIDE Hard Disk
(Upgradeable to 120GB)
2 USB
2.0 Ports
Floppy Drive: 1 x 3.5in floppy drive
CDROM drive: Internal EIDE CD RW Drive (Option of DVD RW Drive)
Keyboard/Mouse: 108 Key Keyboard with touch pad mouse
Network: RJ-45 connector
Operating System: Windows XP
16MB AGP Video Card
Motherboard: ATX with LAN and Built-in Amplified Speakers
Dimensions: 445mm x 333mm x 245mm. Weight 15.5kgs
Chassis: Flame retardant ABS plastic with internal aluminum alloy
chassis. 15g for shock and 1.25g @ 10-100Hz for vibration.
Environmental (operating): 0ºC-50ºC 10% to 80% relative humidity
(non-condensing)
Complies to: CE & FCC Class B, CCC
Carrying Case: Padded case with wheels is included with the PC
Transit Case: Ruggedized transit case is available as an optional extra
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Imaging Digital Flaw Detector
- Pulser: 0-250V pulser with spike/square capability – programmable
transmit damping values of 1000, 292, 117, 97, 72, 66, 56 & 53 ohms and
selectable between pulse-echo (single probe) and pitch-catch (dual
probe) modes.
- Receiver: low-noise wide-band receiver with switchable 50ohm impedance –
signal handling of up to +/-24V before saturation.
- DAC: 90dB gain range – programmable control of: initial gain; delay
until gain increase; rate of gain increase; maximum gain.
- Filters: Low-pass filter values of 1MHz, 2.25MHz, 5MHz, 10MHz & Off;
band-pass filter values of 0.5MHz, 1MHz, 2.25MHz, 5MHz, 7.5MHz, 10MHz,
15MHz & Off; high-pass filter values of 1MHz, 5MHz, 10MHz & Off.
- Rectifier Modes: RF, half-wave +ve, half-wave –ve and full-wave (linear)
– the linear rectified modes have 4 selectable post-rectification
filters.
- Display range: standard controls of display range, display delay and
material velocity.
- Gate: control over start and width – outputs are the maximum value
within gate and the time-of-flight (from start of gate) to this maximum
value.
- Sampling: 8bit A/D conversion into 16MB Image store
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Operation Modes
A-scan: Operation and display is as for standard
digital flaw detectors and this is the usual method for setting up the
gate.
Real-time B-scans: A B-scan image can be built up from
a sequence of A-scans while the beam is scanned through the material
under investigation. Arrays offer very rapid electronic scanning and so
the cross-sectional images are shown as real-time B-scans, allowing the
operator to respond to the on-screen data and hence search a large area
very rapidly. The resolution of the B-scan is dependent on the array
geometry, frequency and electronic signal processing (aperture and
focusing). The user is able to adjust the beam start and finish points
and the step size so as to optimize the coverage and frame rate. The
B-scan display update rate depends on ultrasonic factors such as the
number of beams scanned and the PRF (up to 30kHz) but this may be
constrained by the material properties. Frame rates of over 100Hz are
typical with 64 to 128 beams.
Real-time C-scans: A C-scan map of sub-surface
structures is made by recording the value of a parameter (such as peak
echo or time-of-flight) as an image pixel for each point on the surface.
An array can be translated across the surface, at a right-angle to the
electronic scan, to provide a very rapid C-scan map. The C-scan
resolution and maximum sweep speed are dependent on the array type and
the material properties. However, a typical set-up of a 64 mm long array
producing simultaneous C-scan images (peak amplitude and time-of-flight)
with 1mm x 1mm pixel resolution can be translated at around 110mm/s.
Thus a 1m long x 64mm wide swathe can be acquired in less than 10s.
C-scan stitching: Stitching of adjacent C-scan sweeps
into large area matrix.
Freeze mode: Images can be saved in standard formats
(BMP, TIFF, JPEG and PNG) along with the acquisition set-up for
archiving or for integrating into reports. Images can also be recalled
for reviewing and/or performing measurements. Full-waveform data can be
saved in the industry standard AVI format for easy review in most media
players.
Seamless large area mapping: The FIRE-technology that
provides the capability for real-time B-scan imaging can now be used to
provide rapid full-waveform acquisition over large areas using the
ANDSCAN® system.
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Position Sensor
Trolley: Rigid axle trolley with attachment for array head assembly with
optical encoder for sensing wheel position – 2 buttons allowing local
control of modes during scanning. Optional sprung cable-extension
transducer.
Detector interface: Interface connector on ruggedized laptop (8 pin DIN
+ shield) for optical encoder and buttons.
Scanning jigs: A variety of scanning jigs are available for assisting
with rapid coverage of large areas and generating stitched images – contact
DSL for details.
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Standard Array Interface
MLZ generic array interface: Most piezo-composite and piezo-ceramic
arrays can be used with the Flaw Imager by means of the internal MLZ array
interface unit. This has a 156-way Zero-Insertion Force (ZIF) connector for
handling arrays with up to 128 elements - all Flaw Imager Mk1 probes can be
used with this MLZ interface.
Array Interface options
IMX multiplexed arrays: The IMX multiplexer is an integrated controller
for interfacing small linear arrays to Flaw Detectors and Imagers. A single
multi-way cable between the 24W7 connector on the PC and the IMX is all that
is needed to send the digital beam number to the array and to route the RF
signal back to the Imaging Digital Flaw Detector.
MLA integrated arrays: These are a part of a family of wideband, highly
integrated arrays, which includes pulser-receivers for each element, an
integrated beamformer and an overall controller. They have a single flying
lead, with 24W7 plug, which connects direct to the array interface in the PC
for imaging.
Notes:
1. Diagnostic Sonar reserves the right to modify or change the
specifications of any of its products without notice and without
incurring any responsibility for modifying previously manufactured
products.
2. ANDSCAN® is a registered trademark of QinetiQ Ltd.
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